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ESD SP5.3.4-2022
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This document establishes a procedure for testing components and microcircuits, such as integrated circuits, discrete semiconductor components, and electronic modules containing more than a single component, according to its susceptibility (sensitivity) to damage or degradation by exposure to a defined contact CDM like electrostatic discharge (ESD). This contact-based test method can be performed on packaged devices as well as on bare dies and wafers.
- Published:
- 2022
- ISBN(s):
- 1585373451
- ANSI:
- ANSI Approved
- Number of Pages:
- 24
- File Size:
- 1 file , 590 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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